Palm provides two high purity 99.95 % / 99.99 % grades of 2" Copper Balls weighing 1.1 lb each to meet the demanding needs of most electroplating processes. The oxygen content of Oxygen Free (99.99 %) anodes is controlled to less than 10 ppm providing uniform dissolution in cyanide, pyrophosphate and lubrite baths. Phosphorized Copper Anode Balls (99.95 %) containing 0.04 to 0.065 % phosphorus are required for acid copper solutions. Made in USA.